hs510 heat shrink - Eezee

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Specification Tables

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Soldering & Brazing Equipment

soldering-brazing-equipment-img

BCuP-2, BCuP-5, RBCuZn-D

AWS Classification

BCuP-3, RBCuZn-C

1,460 Degrees F, 1,495 Degrees F, 1,475 Degrees F, 1,715 Degrees F, 1,630 Degrees F

Minimum Brazing Temperature

1,350 Degrees F, 1,325 Degrees F, 1,300 Degrees F, 1,720 Degrees F, 1,670 Degrees F

5/32 in, 3/16 in, 1/4 in, 1/16 in, 3/32 in

Heat-Shrinkable Tube

heat-shrinkable-tube-img

FEP (Fluorinated Ethylene Propylene), PVDF (Polyvinylidene Fluoride), Fluoropolymer, Elastomer, PO (Polyolefin)

Internal Diameter After Contraction

4.45 mm, 7.4mm, 5.3mm, 6.1mm, 3.3mm

Internal Diameter Before Contraction

17.78 mm, 9.525 mm, 17.8mm, 9.9mm, 12.4mm

1.5:1, 2:1, 1.67:1, 2.5:1, 3:1

3m, 100m, 50m, 1.22 m, 152.4 mm

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Multicomp Pro HS510-1.22M Penyusut Panas, 1.5MM, Hitam, 1.22M