500mw metal - Eezee

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Specification Tables

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Soldering & Brazing Equipment

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BCuP-2, BCuP-5, RBCuZn-D

AWS Classification

BCuP-3, RBCuZn-C

1,460 Degrees F, 1,495 Degrees F, 1,475 Degrees F, 1,715 Degrees F, 1,630 Degrees F

Minimum Brazing Temperature

1,350 Degrees F, 1,325 Degrees F, 1,300 Degrees F, 1,720 Degrees F, 1,670 Degrees F

5/32 in, 3/16 in, 1/4 in, 1/16 in, 3/32 in

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Resistor Film Logam Multicomp Pro MCMF0W2FF2202A10, 22KOHM, 500mW, 1%

Resistor Film Logam Multicomp Pro MCMF0W2FF3303A10, 330KOHM, 500mW, 1%

Resistor Film Logam Multicomp Pro MCMF0W2FF6802A10, 68KOHM, 500mW, 1%

Multicomp Pro MF50 8K2 Res, 8K2, 1%, 500MW, Aksial, Film Logam

Multicomp Pro MF50 2R2 Res, 2R2, 1%, 500MW, Aksial, Film Logam

Multicomp Pro MF50 1R5 Res, 1R5, 1%, 500MW, Aksial, Film Logam

Multicomp Pro MF50 4R7 Res, 4R7, 1%, 500MW, Aksial, Film Logam

Multicomp Pro MF50 1R Res, 1R, 1%, 500MW, Aksial, Film Logam

Multicomp Pro MF50 3R3 Res, 3R3, 1%, 500MW, Aksial, Film Logam

Multicomp Pro MCMF0W2FF2001A10 Resistor Film Logam, 20 Ohm, 500mW, 1%

Multicomp Pro MCMF0S2BB1001A20 Resistor Film Logam, 1KOHM, 500mW, 0,1%, Bertimbal Radial

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